In collaboration with Brunton Publications, FESPA presents a top-class lineup of speakers for the conference at the first Corrugated trade fair, taking place from May 19 to 22. The free conference program in Hall 3 (Booth B162) offers corrugated board professionals insights into the latest trends, challenges, and developments.
The first day of the conference, themed “Mastering the Digital Revolution,” opens with a panel discussion featuring experts from leading manufacturers, including HP, EFI, Koenig & Bauer, and Kento, on the evolution of printing. Stefan Liversidge from OPSWAT reports on the escalation of cyber threats and explains why cybersecurity has become a cornerstone of resilience in production and the supply chain. Christian Vionnet from BOBST examines common market assumptions and asks why the online retail bubble is about to burst.
The focus of the second day of the conference is operational excellence. Thomas Orthax from Packitoo explains how AI automation and digitization can support workflows for configuration, pricing, and quotation creation. Lorenzo de la Mora from the Gran Via Brewery and Javier Quesada from Kento present a case study comparing digital, analog, and hybrid technologies used to streamline packaging design and production. Jo Stephenson from Young People In Print discusses how to attract the next generation of talent in the face of the challenges posed by an aging population. David Preskett from Kongsberg Precision Cutting Systems explains how business needs drive the development of state-of-the-art production tools and shape trends in the global packaging industry.
The third day of the conference addresses regulatory frameworks. Dr. Aaron Yeardley from Tunley Environmental provides insights into the ESRS E5 standard and the circular economy in the context of evolving regulatory frameworks for raw materials, printing inks, varnishes, and coatings. Evert Delbanco of the Flint Group will discuss the framework for raw materials and the circular economy. Ian Bates of NOA Ltd. will present future prospects for the European corrugated board market, material innovations, and the transition to high-performance, scalable fiber solutions
Nick Kirby, FESPA Ambassador for Corrugated Board, explains: “Preparations for the first Corrugated are in full swing, and I look forward to welcoming professionals from across the industry who want to learn about the latest developments, trends, and much more. Attendees of the Corrugated conference will gain comprehensive insights into how corrugated board and printing/signmaking can work together to unlock new revenue opportunities for companies in both sectors.”
The conference program is available at https://europe.fespa.com/whats-on/conference-programme.
FESPA
Founded in 1962, FESPA is an association of trade associations that organizes exhibitions and conferences for the screen and digital printing industries. FESPA’s objectives are to promote screen printing and digital imaging, and to facilitate the exchange of knowledge about screen and digital printing among its members worldwide to support business expansion and keep them informed about the latest developments in these rapidly growing industries.
